聚晶金刚石复合片残余热应力的影响因素Analysis of the influencing factors of residual thermal stress of polycrystalline diamond compact
罗德,张菁,黎明发,孙振亚,范端
LUO De1,ZHANG Jing1,LI Mingfa 2,SUN Zhenya2,FAN Duan2(1.School of Mechanical and Electronic Engineering
摘要(Abstract):
残余热应力是影响聚晶金刚石复合片(PDC)性能好坏的最重要因素之一。考虑聚晶金刚石层(PCD)与硬质合金层厚度比以及PDC压制过程中烧结温度的波动对聚晶金刚石复合片残余热应力的影响,在ANSYS中建立PDC模型,运用热-结耦合法分析PDC的残余热应力。计算表明,随着PCD层与硬质合金层厚度比由0.067增加到0.333,PCD层表面中心的压应力由1.61 GPa降低到380 MPa,PCD层最大径向压应力由1.61 GPa降低1.03 GPa左右,而PCD层边缘靠近界面附近最大轴向拉应力逐渐增大;随着PDC压制过程中烧结温度由1 000℃升高到1 500℃,PCD层的最大径向压应力、最大轴向拉应力以及最大剪应力等均逐渐增大。认为,在研究PDC合成新工艺过程中,应在保证PDC使用寿命的前提下尽量降低PCD层与硬质合金层厚度比;必须尽量切断原材料以及人为操作对温度的影响。
The residual stress in polycrystalline diamond compact interface is one of important factors to evaluate the quality of its performance.Considering the effects of the thickness ratio of PDC layer and temperature fluctuations during the sintering process on the residual thermal stress of PDC,this paper analyzed the residual thermal stress of PDC by the use of a well-known finite element analysis software ANSYS.The results show that as the thickness ratio of PDC layer increases from 0.067 to 0.333,the maximum radial compressive stress of PDC layer decreases from 1.61 GPa to 1.03 GPa,but the maximum axial tensile stress near the interface of PDC layer gradually increases.As the sintering temperature increases from 1 000℃ to 1 500℃,the maximum radial compressive stress,maximum axial tensile stress and maximum shear stress of PDC layer gradually increase.With respect to the analysis,the thickness ratio of PDC layer should be reduced under condition of ensuring the life of PDC,and the effects of raw materials and human operations on the temperature must be avoided.
关键词(KeyWords):
聚晶金刚石复合片(PDC);烧结温度;残余热应力
polycrystalline diamond compact(PDC);sintering temperature;residual stress.
基金项目(Foundation):
作者(Author):
罗德,张菁,黎明发,孙振亚,范端
LUO De1,ZHANG Jing1,LI Mingfa 2,SUN Zhenya2,FAN Duan2(1.School of Mechanical and Electronic Engineering
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